SpeCLED–LED 芯片中电流扩散和温度分布的 3D 建模

                                             

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SpeCLED–LED 芯片中电流扩散和温度分布的 3D 建模

SpeCLED (Spreading of Current in Light-Emitting Diodes) 是一款用于平面和垂直 LED 芯片中电流扩散和热传导建模的软件。其中一项任务是模拟有源区的电流密度分布、内部量子效率 (IQE) 有源区温度的分布。此外,SpeCLED  软件还能计算正向电压、输出发射功率、壁插效率等器件积分特性与正向电流的函数关系。

SpeCLED 软件 LED 芯片视为通过平面技术操作制造的芯片。这样就可以逐层输入实际的 3D 芯片几何图形,从而更容易建立模拟案例。自动或手动生成非结构/结构平面棱柱形网格。用户可根据需要改变网格细化程度。网格中的不同区块会自动识别,并根据组成层的描述确定其属性。用户可通过脚本指定复杂的半导体层结构,包括非均匀掺杂和组成。

Basic design of 815×875 μm2 blue LED die

 

采用 3D 模型来模拟准中性区中的电流扩散,在该区域载流子漂移比扩散占主导地位。有源区被认为是面内分布的非线性电阻器,具有已知的温度相关 j-U 特性,该特性涉及将局部正常电流密度 j 与施加到有源区的 pn 结偏置 U 相关联。这些特性既可以手动定义,也可以从外部文件导入。因此,j-U 特性可以从 SiLENSe 的 1D 模拟中获得。

 

                                           

                                              Specification of the die geometry                                                                         Automatic mesh generation     

  

                                      

                                             Current density distribution in the active region                                                          2D distribution of Internal Quantum Efficiency

                                         

Vectors of electric current in selected horizontal cross-section

 

Publications by STR team and SpeCLED users

“High-efficiency GaN-based LED with patterned SiO2 passivation layer and discontinuous current block layer”, Shengjun Zhou, Mengling Liu, Haohao Xua, Yingce Liu, Yilin Gao, Xinghuo Ding, Shuyu Lan, Yuchen Fan, Chengqun Gui, Sheng Liu, Optics and Laser Technology 109 (2019) 627–632, https://doi.org/10.1016/j.optlastec.2018.08.049 

Effect of Die Shape and Size on Performance of III-Nitride Micro-LEDs: A Modeling Study by Kirill A. Bulashevich, Sergey S. Konoplev and Sergey Yu. Karpov, Photonics 2018, 5(4), 41

“Current crowding and self-heating effects in AlGaN-based flip-chip deep-ultraviolet light-emitting diodes”, Guo-Dong Hao, Manabu Taniguchi, Naoki Tamari, and Shin-ichiro Inoue, J. Phys. D: Appl. Phys. 51 (2018) 035103 (5pp), https://doi.org/10.1088/1361-6463/aa9e0e

“From Large‐Size to Micro‐LEDs: Scaling Trends Revealed by Modeling” by  Sergey S. Konoplev, Kirill A. Bulashevich, Sergey Yu. Karpov, (2017) https://doi.org/10.1002/pssa.201700508

Impact of surface recombination on efficiency of III-nitride light-emitting diodes by Kirill A. Bulashevich and Sergey Yu. Karpov, PSS Rapid Research Letters, Volume 10, Issue 6, June 2016, Pages: 480–484

“Thermal resistanse and nonuniform distribution of electroluminescence and temperature in high-power AlGaInN light-emitting diodes” by A.V.Aladov, K.A.Bulashevich, A.E.Chernyakov, S.Yu.Karpov, V.P.Valyukhov, A.L.Zakgeim, St. Petersburg Polytechnical University Journal: Physics and Mathematics, Volume 1, Issue 2, 2015, 151-158, https://doi.org/10.1016/j.spjpm.2015.05.001

“Comparison of Electrical, Thermal, and Optical characteristics of High-Power LEDs operating in various spectral ranges: from UV to green” by A.E. Chernyakov, A.L. Zakgeim, K.A. Bulashevich, S.Yu. Karpov, 2015 16th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, Budapest, 2015, pp. 1-5, DOI: 10.1109/EuroSimE.2015.7103132

“Theoretical and Experimental Study of Thermal Management in High-Power AlInGaN LEDs” by A.E. Chernyakov, A.L. Zakgeim, K.A. Bulashevich, S.Yu. Karpov, V.l. Smirnov, V.A. Sergeev, 2014 15th International Conference on Thermal, Mechanical and Mulit-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Ghent, 2014, pp. 1-5, DOI: 10.1109/EuroSimE.2014.6813819

“Experimental and theoretical study of electrical, thermal, and optical characteristics of InGaN/GaN high-power flip-chip LEDs” by A. E. Chernyakov, K. A. Bulashevich, S. Yu. Karpov, and A. L. Zakgeim, Phys. Status Solidi A 210, No. 3, 466–469 (2013) / DOI 10.1002/pssa.201200658

Sergey Yu. Karpov“Modeling of III-nitride Light-Emitting Diodes: Progress, Problems, and Perspectives”, Proc. of SPIE, vol. 7939 (2011) 79391C / DOI 10.1117/12.872842

M. V. Bogdanov, K. A. Bulashevich, O. V. Khokhlev, I. Yu. Evstratov, M. S. Ramm, and S. Yu. Karpov“Current crowding effect on light extraction efficiency of thin-film LEDs”, phys. stat. solidi (c) 7, No 7–8, 2124–2126 (2010)

M. V. Bogdanov, K. A. Bulashevich, O. V. Khokhlev, I. Yu. Evstratov, M. S. Ramm, and S. Yu. Karpov“Effect of ITO spreading layer on performance of blue light-emitting diodes”, phys. stat. solidi (c) 7, No 7-8, 2127–2129 (2010)

K. A. Bulashevich, O. V. Khokhlev, M. V. Bogdanov, M. S. Ramm, I. Yu. Evstratov, and S. Yu. Karpov“Comparison of Alternative Approaches to High-Power Thin-Film LED Chip Design”, Proceedings of the Second International Conference on White LEDs and Solid State Lighting, Taipei (2009)

M.V. Bogdanov, K.A. Bulashevich, I.Yu. Evstratov, S.Yu. Karpov“Current spreading, heat transfer, and light extraction in multipixel LED array”, phys. stat. solidi (c) 5, No. 6, 2070–2072 (2008)

K.A. Bulashevich, I.Yu. Evstratov, V.F. Mymrin, S.Yu. Karpov“Current spreading and thermal effects in blue LED dice”, phys. stat. solidi (c) 4, No. 1, 45–48 (2007).

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